Systems and methods for improved semiconductor etching and component protection

ABSTRACT

Semiconductor systems and methods may include a semiconductor processing chamber having a gas box defining an access to the semiconductor processing chamber. The chamber may include a spacer characterized by a first surface with which the gas box is coupled, and the spacer may define a recessed ledge on an interior portion of the first surface. The chamber may include a support bracket seated on the recessed ledge that extends along a second surface of the spacer. The chamber may also include a gas distribution plate seated on the support bracket.

CROSS-REFERENCES TO RELATED APPLICATIONS

This case relates to U.S. application Ser. No. 15/159,478, having thesame name and being filed concurrently on May 19, 2016. The entiredisclosure of that application is hereby incorporated by reference inits entirety for all purposes.

TECHNICAL FIELD

The present technology relates to systems and methods for etchingsemiconductor materials. More specifically, the present technologyrelates to chambers and methods for etching with improved degradationcharacteristics for chamber components.

BACKGROUND

Integrated circuits are made possible by processes which produceintricately patterned material layers on substrate surfaces. Producingpatterned material on a substrate requires controlled methods forremoval of exposed material. Chemical etching is used for a variety ofpurposes including transferring a pattern in photoresist into underlyinglayers, thinning layers, or thinning lateral dimensions of featuresalready present on the surface. Often it is desirable to have an etchprocess that etches one material faster than another facilitating, forexample, a pattern transfer process. Such an etch process is said to beselective to the first material. As a result of the diversity ofmaterials, circuits, and processes, etch processes have been developedwith a selectivity towards a variety of materials.

Etch processes may be termed wet or dry based on the materials used inthe process. A wet HF etch preferentially removes silicon oxide overother dielectrics and materials. However, wet processes may havedifficulty penetrating some constrained trenches and also may sometimesdeform the remaining material. Dry etches produced in local plasmasformed within the substrate processing region can penetrate moreconstrained trenches and exhibit less deformation of delicate remainingstructures. However, local plasmas may damage the substrate through theproduction of electric arcs as they discharge. Additionally, plasmaeffluents can damage chamber components that may require replacement ortreatment.

Thus, there is a need for improved systems and methods that can be usedto produce high quality devices and structures. These and other needsare addressed by the present technology.

SUMMARY

Semiconductor systems and methods may include a semiconductor processingchamber having a gas box defining an access to the semiconductorprocessing chamber. The chamber may include a spacer characterized by afirst surface with which the gas box is coupled, and the spacer maydefine a recessed ledge on an interior portion of the first surface. Thechamber may include a support bracket seated on the recessed ledge thatextends along a second surface of the spacer. The chamber may alsoinclude a gas distribution plate seated on the support bracket.

Exemplary chambers may also include an annular liner contacting the gasdistribution plate and extending about a surface of the support bracket.The chambers may include a top plate seated on the annular liner andpositioned proximate a surface of the gas box. In embodiments, the gasdistribution plate, the annular liner, and the top plate may be orinclude quartz, a ceramic, or coated aluminum. The support bracket andthe spacer may at least partially comprise hard anodized aluminum orcoated aluminum. Chambers may also include a pedestal configured tosupport a semiconductor substrate, and the pedestal may include aceramic heater configured to heat the semiconductor substrate to betweenabout 300° C. and 500° C.

In embodiments, a delivery tube may couple the semiconductor processingchamber at the gas box access with a remote plasma source, and thedelivery tube may include a quartz interior surface. The quartz interiorsurface may include a quartz liner disposed within an aluminum deliverytube. The delivery tube may also include an adaptor coupling thedelivery tube with a remote plasma source unit, and the adaptor mayinclude a shim proximate the delivery tube.

The present technology may also include a semiconductor processingsystem that may include a remote plasma source as well as a deliverytube coupled with the remote plasma source. The system may include asemiconductor processing chamber that may include a gas box defining anaccess to the semiconductor processing chamber. In embodiments, theaccess may be centrally located within the gas box, and the deliverytube may be coupled with the gas box at the access. The chamber may alsoinclude a spacer characterized by a first surface with which the gas boxis coupled, and the spacer may define a recessed ledge on an interiorportion of the first surface. The chamber may include a support bracketseated on the recessed ledge and extending along a second surface of thespacer. A portion of the gas box may at least partially extend parallelto the second surface of the spacer, and the support bracket may be atleast partially positioned between the second surface of the spacer andthe portion of the gas box at least partially extending parallel to thesecond surface of the spacer. The chamber may also include a gasdistribution plate seated on the support bracket.

The system may also include within the chamber an annular linercontacting the gas distribution plate and extending about an interiorsurface of the support bracket. The chamber may include a top plateseated on the annular liner and positioned proximate a surface of thegas box. The portion of the gas box may include a surface of a recessedportion of the gas box, and the recessed portion of the gas box may bepositioned adjacent a portion of the support bracket extending along thesecond surface of the spacer. In embodiments, the gas distributionplate, the annular liner, and the top plate may be or include quartz, aceramic, or coated aluminum.

In embodiments, the top plate may extend within an outer diameter of theaccess defined by the gas box and may contact the delivery tube or anadaptor positioned at an outlet of the delivery tube. The supportbracket and the spacer may at least partially be or include hardanodized aluminum or coated aluminum. The chamber may also include apedestal configured to support a semiconductor substrate, and thepedestal may include or be a ceramic heater configured to heat thesemiconductor substrate to between about 300° C. and 500° C. Inembodiments, the delivery tube may be or include a quartz interiorsurface. Additionally, the gas distribution plate may include one ormore rings of apertures extending radially outward from a central axisof the gas distribution plate.

The present technology may also include a method of etching a substratein a semiconductor processing chamber. The method may include deliveringa chlorine-containing precursor to a remote plasma source whilegenerating a plasma to produce plasma effluents. The method may includeflowing the plasma effluents through a quartz gas distribution plate inthe semiconductor processing chamber. The method may also includeetching the substrate at a temperature between about 300° C. and about500° C.

The present technology may also include a semiconductor processingsystem having a remote plasma source. The system may include a deliverytube coupled with the remote plasma source. The system may also includea semiconductor processing chamber, and the semiconductor processingchamber may include a gas box coupled about a distal region of thedelivery tube. The chamber may include a first annular supportcontacting the gas box at a first surface of the first annular support,and the first annular support and the gas box together may define afirst channel about an interior region of the semiconductor processingchamber. The chamber may also include a gas distribution plate seatedwithin the first channel.

The processing chamber may also include an annular liner seated on thegas distribution plate. The chamber may include a top plate seated onthe annular liner, and the annular liner and the top plate may be bothat least partially seated within the first channel. The chamber mayinclude a second annular support contacting the first annular support ata second surface of the first annular support opposite the first surfaceof the first annular support. The second annular support and the firstannular support together may define a second channel about an interiorregion of the semiconductor processing chamber. The chamber may alsoinclude a second gas distribution plate seated within the secondchannel. In embodiments, the first gas distribution plate and the secondgas distribution plate may each be one of or include quartz, a ceramic,or coated aluminum.

The processing chamber may also include at least one pin removablycoupling the gas distribution plate with the first annular support. Thedelivery tube may define at least a portion of a channel between theremote plasma unit and the gas box configured to allow precursordelivery through the delivery tube into the semiconductor processingchamber that bypasses the remote plasma source. The chamber may alsoinclude an insert positioned within the delivery tube, and the insertmay provide access to a mixing region of the insert from the remoteplasma source and the at least a portion of a channel of the deliverytube. In embodiments, the mixing region of the insert may include afirst mixing section characterized by a tapered shape from the access tothe mixing region of the insert, and the mixing region of the insert mayinclude a second mixing section characterized by an expanding internaldiameter from a position proximate the first mixing section to an outletof the delivery tube.

In embodiments, the mixing region of the insert further may include athird mixing section characterized by a cylindrical shape having aninternal diameter that is less than half the internal diameter of thedelivery tube. Additionally, the gas box may include a first gas boxplate and a second gas box plate coupled with one another. The secondgas box plate may at least partially contact the first annular supportalong a second surface of the second gas box plate opposite a firstsurface of the second gas box plate contacting the first gas box plate.Also, the second gas box plate may define a plurality of channels, andthe coupled first gas box plate and second gas box plate may define aflow path through the plurality of channels. In embodiments, the firstgas box plate may define a port providing access to a channel of theplurality of channels. The second gas box plate may define at least oneentry channel providing access from the plurality of channels to aninterior region of the semiconductor processing chamber, and the atleast one entry channel may be positioned radially outward from the portdefined by the first gas box plate.

The present technology may also include a semiconductor processingchamber having a gas box providing access to the semiconductorprocessing chamber. The chamber may include a first annular supportcontacting the gas box at a first surface of the first annular support,and the first annular support and the gas box may each define a portionof a first channel located at the interface of the gas box and the firstannular support. The chamber may include a first gas distribution plateseated within the first channel. Additionally, the chamber may include asecond annular support contacting the first annular support at a secondsurface of the first annular support opposite the first surface of thefirst annular support. The second annular support may at least partiallydefine a second channel located about an interior region of thesemiconductor processing chamber. The chamber may also include a secondgas distribution plate seated within the second channel, and the firstgas distribution plate and the second gas distribution plate may be orinclude quartz in embodiments.

The processing chamber may also include an annular liner seated on thefirst gas distribution plate. The chamber may include a top plate seatedon the annular liner, and the annular liner and the top plate may bothat least partially be seated within the first channel. In embodiments,the first gas distribution plate and the second gas distribution platemay be characterized by a similar shape and may each define a pluralityof apertures located in rings about the gas distribution plate.Additionally, the gas box may include a first gas box plate and a secondgas box plate coupled with one another. The second gas box plate may atleast partially contact the first annular support along a second surfaceof the second gas box plate opposite a first surface of the second gasbox plate contacting the first gas box plate. The second gas box platemay define a plurality of channels, and the coupled first gas box plateand second gas box plate may define a flow path through the plurality ofchannels. In embodiments, the first gas box plate may define a portproviding access to a channel of the plurality of channels.Additionally, the second gas box plate may define at least one entrychannel providing access from the plurality of channels to an interiorregion of the semiconductor processing chamber. In embodiments, the atleast one entry channel may be positioned radially outward from the portdefined by the first gas box plate.

Such technology may provide numerous benefits over conventionaltechniques. For example, the technology may allow improved protection ofchamber components that may otherwise be affected by plasma precursors.Additionally, the technology may allow improved component replacementand access based on the chamber design. These and other embodiments,along with many of their advantages and features, are described in moredetail in conjunction with the below description and attached figures.

BRIEF DESCRIPTION OF THE DRAWINGS

A further understanding of the nature and advantages of the disclosedembodiments may be realized by reference to the remaining portions ofthe specification and the drawings.

FIG. 1 shows a top plan view of one embodiment of an exemplaryprocessing system.

FIG. 2 shows a schematic cross-sectional view of an exemplary processingsystem according to embodiments of the present technology.

FIG. 3 shows a schematic cross-sectional view of a portion of anexemplary processing chamber according to embodiments of the presenttechnology.

FIG. 4 shows a schematic cross-sectional view of a delivery system foran exemplary processing chamber according to embodiments of the presenttechnology.

FIG. 5A shows a top plan view of an exemplary gas distribution plateaccording to embodiments of the present technology.

FIG. 5B shows a top plan view of an exemplary gas distribution plateaccording to embodiments of the present technology.

FIG. 6 shows a partial schematic cross-sectional view of a portion of anexemplary processing chamber according to embodiments of the presenttechnology.

FIG. 7 shows a cross-sectional plan view of an exemplary gasdistribution plate according to embodiments of the present technology.

FIG. 8 shows a schematic cross-sectional view of a portion of anexemplary processing chamber according to embodiments of the presenttechnology.

FIG. 9 shows a cross-sectional plan view of an exemplary gas boxarrangement according to embodiments of the present technology.

FIG. 10 shows a cross-sectional view of a portion of an exemplary gasbox arrangement according to embodiments of the present technology.

FIG. 11 illustrates a method of etching a substrate according toembodiments of the present technology.

In the appended figures, similar components and/or features may have thesame numerical reference label. Further, various components of the sametype may be distinguished by following the reference label by a letterthat distinguishes among the similar components and/or features. If onlythe first numerical reference label is used in the specification, thedescription is applicable to any one of the similar components and/orfeatures having the same first numerical reference label irrespective ofthe letter suffix.

DETAILED DESCRIPTION

In semiconductor processing, etching may be performed for a number ofreasons. In dry etching, precursors may be flowed through plasma toproduce radical plasma effluents for etching various semiconductormaterials. These precursors may include one or more corrosive elementsincluding fluorine, chlorine, or any other chemical element. Theseelements are exposed not only to the substrate or materials to beetched, but also to the chamber components in which the processing isperformed. As a result, exposed surfaces of the chamber may be etched,sputtered, or otherwise degraded by the plasma or the effluents producedby the plasma. The extent of the degradation may be related to thereactivity between the chamber components and the precursors used forthe etching.

Conventional technologies have often dealt with this degradation byproviding replaceable components within the chamber. Accordingly, whencoatings or components themselves are degraded, the component may beremoved and replaced with a new component that will in turn degrade overtime. Not only does this degradation and replacement cost processingtime and money, but the degradation itself can impact the processesbeing performed. For example, as components or coatings are beingdegraded, particles from the components and coatings affected may bedeposited on the substrate being worked. This can cause problems withproduction including short-circuiting of components as well as unevenprocessing.

Many semiconductor chamber components may be made of aluminum. Whenchlorine-based precursors are used in processing, the chlorine, as wellas chlorine radicals, are corrosive and can quickly damage exposedaluminum chamber components. One mechanism for reducing this corrosionis to coat exposed aluminum pieces. However, coating any exposedmaterial can be expensive, imperfect, and can introduce fouling as thematerial degrades over time. Hence, the more material being coated, thehigher may be the chance of having issues with the coating.

The present technology utilizes alternative components within thechamber to reduce the impact of etchants on the chamber. By removing theplasma generation from the chamber in embodiments, bombardment damage tochamber components can also be reduced. Although the disclosure willroutinely identify specific etching processes utilizing the disclosedtechnology, it will be readily understood that the systems and methodsare equally applicable to deposition and cleaning processes as may occurin the described chambers. As such, the technology should not beconsidered to be so limited as for use with etching processes alone.

FIG. 1 shows a top plan view of one embodiment of a processing system100 of deposition, etching, baking, and curing chambers according todisclosed embodiments. In the figure, a pair of front opening unifiedpods (FOUPs) 102 supply substrates of a variety of sizes that arereceived by robotic arms 104 and placed into a low pressure holding area106 before being placed into one of the substrate processing chambers108 a-f, positioned in tandem sections 109 a-c. A second robotic arm 110may be used to transport the substrate wafers from the holding area 106to the substrate processing chambers 108 a-f and back. Each substrateprocessing chamber 108 a-f, can be outfitted to perform a number ofsubstrate processing operations including the etch processes describedherein in addition to cyclical layer deposition (CLD), atomic layerdeposition (ALD), chemical vapor deposition (CVD), physical vapordeposition (PVD), etch, pre-clean, degas, orientation, and othersubstrate processes.

The substrate processing chambers 108 a-f may include one or more systemcomponents for depositing, annealing, curing and/or etching a dielectricfilm on the substrate wafer. In one configuration, two pairs of theprocessing chamber, e.g., 108 c-d and 108 e-f, may be used to depositdielectric material on the substrate, and the third pair of processingchambers, e.g., 108 a-b, may be used to etch the deposited dielectric.In another configuration, all three pairs of chambers, e.g., 108 a-f,may be configured to etch a material on the substrate. Any one or moreof the processes described below may be carried out in chamber(s)separated from the fabrication system shown in different embodiments. Itwill be appreciated that additional configurations of deposition,etching, annealing, and curing chambers for dielectric films arecontemplated by system 100. Any of the chambers described below may beutilized in the processing system 100, and may be included as tandemchambers, which may include two similar chambers sharing precursor,environmental, or control features.

FIG. 2 shows a schematic cross-sectional view of an exemplary processingsystem 200 according to embodiments of the present technology. Thesystem may include a processing chamber 205, and a remote plasma source(“RPS”) unit 210. The RPS unit 210 may be stabilized on a platform 212having support members 214 that may couple with the processing chamber205 at one or more positions about the processing chamber 205. Byutilizing additional support members 214 along with platform 212, theweight of the RPS unit 210 may be properly distributed to protectcomponents from sheer or other stresses related to the weight of the RPSunit 210. A delivery tube 216 may be coupled between or with the RPSunit 210 and the processing chamber 205 for delivering one or moreprecursors to the processing chamber 205. A flange adaptor 218 may bepositioned about the delivery tube 216 in order to provide additionalstability and support against the RPS unit 210, which may otherwisedamage the delivery tube 216 from the support weight. The flange adaptor218 may contact the platform 212 to provide support for the RPS unit210, additionally so that the weight of the RPS unit 210 is not borne onthe delivery tube 216.

The processing chamber 205 may include a gas box 220 providing access tothe processing chamber 205. The gas box 220 may define an access to theprocessing chamber 205, and in embodiments, the access may be centrallydefined or located within the gas box 220. The delivery tube 216 may bepositioned or coupled within the access of the gas box 220 providing aprecursor path between the RPS unit 210 and the interior of theprocessing chamber 205. The flange adaptor 218 may also contact the topplate 220 to distribute at least a portion of the weight of the RPS unit210, to prevent or reduce stress on the delivery tube 216.

In embodiments a spacer 222 may at least partially define the processingchamber 205 exterior and interior walls. A gas distribution assembly 225may be positioned within the processing chamber 205 proximate thedelivery tube 216, and the gas distribution assembly 225 may allowdistribution of precursors or plasma effluents into the processingchamber 205. A pumping liner 230 may be positioned within a processingregion of the processing chamber 205. The pumping liner 230 may allowunreacted precursors or plasma effluents to be exhausted from theprocessing chamber 205. The pumping liner 230 may additionally allowparticles etched in an etching process to be removed from the processingchamber 205 to prevent the particles from remaining on the substrateduring subsequent processing operations.

A pedestal 235 may be included in the processing region of theprocessing chamber 205 and may be configured to support a substrateduring etching or other process operations. The pedestal 235 may haveone or more chucking mechanisms in various embodiments includingelectrostatic, vacuum, or gravitational, for example. The pedestal 235may be rotatable or translatable in embodiments, and may be raisedtowards or lowered from the gas distribution assembly 225. Inembodiments the pedestal 235 may include one or more lift pins foraiding transfer of a substrate into and out of the processing chamber205. Pedestal 235 may additionally include heating or cooling mechanismsfor maintaining substrate temperatures during processing operations.

The pedestal 235 may include an inlaid heating element including afilament, or may include one or more tubes or channels configured topass a temperature controlled fluid that may raise or lower thetemperature accordingly. Pedestal 235 may include a platform forsupporting a substrate that is or includes a ceramic heater. The ceramicheater may heat the substrate to particular operating temperaturesincluding from about 20° C. to over 1000° C. in embodiments. The ceramicheater may additionally heat the substrate above about 50° C., aboveabout 100° C., above about 150° C., above about 200° C., above about250° C., above about 300° C., above about 350° C., above about 400° C.,above about 500° C., or higher in embodiments. The ceramic heater mayadditionally maintain the substrate temperature below about 1000° C.,below about 900° C., below about 800° C., below about 700° C., belowabout 600° C., or below about 500° C. in embodiments. The ceramic heatermay additionally be configured to heat or maintain the substratetemperature between about 100° C. and about 500° C. in embodiments, orbetween about 300° C. and about 500° C. in embodiments. In embodimentsthe heater is configured to maintain the substrate temperature belowabout 300° C., in which case alternative metal heating elements may beused instead of a ceramic heater. For example, a coated aluminum heatermay be used, or an embedded or coated heater on an aluminum or treatedaluminum pedestal.

The components of processing chamber 205 may be configured to withstandthe operating environment during etching or other processing operations.The components of processing chamber 205 may be an anodized or oxidizedmaterial, including hard anodized aluminum, for example. Each componentwithin processing chamber 205 that may be contacted by plasma effluentsor other corrosive materials may be treated or coated to protect againstcorrosion. Alternative materials may also be utilized to protect againstcorrosion from plasma effluents including fluorine or chlorine inembodiments. For example, one or more components within processingchamber 205 may be ceramic or quartz in embodiments. As a particularexample, one or more components of gas distribution assembly 225, spacer222, pumping liner 230, or any component that may be contacted by plasmaor non-plasma precursors may be or include quartz or ceramic.Additionally, delivery tube 216 may be or include quartz, such asincluding a quartz liner within the delivery tube 216. The delivery tubemay be aluminum or hard anodized aluminum in embodiments, and may becharacterized by a quartz interior surface. RPS unit 210 may also belined with quartz in order to protect the internal components fromcorrosion caused by precursors dissociated within the RPS unit 210including or chlorine, for example. The RPS unit 210 may includeanodized metals, and the RPS unit 210 chamber cavities may be lined withquartz to further protect against corrosion.

By utilizing a remote plasma from RPS unit 210, the processing chamber205 may be further protected against internal corrosion caused by plasmageneration. In embodiments, processing chamber 205 may not be configuredto produce a plasma, and plasma generation may be performed externallyto the processing chamber 205 in RPS unit 210. In embodiments additionalplasma processing may be performed within processing chamber 205, suchas by a capactively-coupled plasma, although other plasma sources may beused. For example, gas box 220 and one or more components of the gasdistribution assembly 225 may be utilized as electrodes by which acapacitively-coupled plasma may be produced. Additional or alternativeplasma components within the chamber may be used to assist withrecombination of plasma effluents by reducing the path length fromplasma generation to interaction with a substrate.

Precursors dissociated by plasma will recombine after a certainresidence time. For example, after a chlorine-based precursor isdissociated within RPS unit 210, the precursor or plasma effluents maybe flowed through delivery tube 216 into processing chamber 205, andthen interact with a substrate on pedestal 235. Depending on the lengthof the path of travel for the radical effluents, the effluents orradicals may recombine and at least partially lose the reactivity of theradical precursor. Additionally, the more complicated the path oftravel, such as through various tubes or channels, the more protectionmay be included in the system as each component in contact with theplasma effluents may be treated or coated to protect from corrosion.Accordingly, processing chamber 205 may include a relatively straightline of travel from RPS unit 210 into processing chamber 205, and thenthrough exhaust plenum 230. Additionally, once within processing chamber205, precursors or plasma effluents may travel through one or moreinline aspects of the gas distribution assembly 225 to contact asubstrate. Components of the gas distribution assembly 225 may beutilized to improve uniformity of flow towards a substrate, butotherwise maintain a reduced length of precursor flow path to reducerecombination of the plasma effluents as well as residence time withinthe processing chamber 205.

Turning to FIG. 3 is shown a schematic cross-sectional view of a portionof an exemplary processing chamber 205 according to embodiments of thepresent technology. FIG. 3 includes a partial view of components of gasdistribution assembly 225 of FIG. 2, and may include similar componentsas previously described. Processing chamber 205 as illustrated in FIG. 3may include delivery tube 216, flange adaptor 218, gas box 220, andspacer 222, for example. As shown with additional detail, spacer 222 maybe characterized by a first surface 321 with which the gas box 220 iscoupled. Spacer 222 may define a recessed ledge 323 on an interiorportion of the first surface 321 in embodiments. An interior portion maybe a portion located radially towards a central axis of the processingchamber 205 relative to the component or relative to the chamber, forexample, or may be a portion facing the interior of the processingchamber 205. As illustrated in the figure, recessed ledge 323 may beformed on the side of the first surface 321 of spacer 222 towards theinterior of the processing chamber 205, and may be located proximate thecoupling location of gas box 220. Gas box 220 may at least partiallycover recessed ledge 323 in embodiments, and may completely coverrecessed ledge 323.

A support bracket 305 may be seated on the recessed ledge 323 of spacer222. The support bracket 305 may extend along a second surface 324 ofthe spacer 222. The second surface 324 of spacer 222 may face theinterior of processing chamber 205, and be a surface of spacer 222adjacent first surface 321 in embodiments. Support bracket 305 mayextend at about or essentially a right angle from recessed ledge 323along second surface 324 of spacer 222. Support bracket 305 may becharacterized by an S or Z-shape depending on orientation to providesupport ledge 307 extending from support bracket 305 into processingchamber 205. Support bracket 305 may have an annular shape and extendabout the interior of processing chamber 205. A gasket or o-ring 309 maybe positioned adjacent support bracket 305, and may be radially outwardfrom support bracket 305 in the processing chamber 205 configuration.Gasket 309 may be positioned between gas box 220 and spacer 222 toprovide a fluid seal about the components and support bracket 305. Whengas box 220 is coupled with spacer 222, gasket or o-ring 309 may becompressed to form a seal between the components.

As further illustrated, a portion of the gas box 220 may also extendbeyond the first surface 321 of the spacer 222 to which the gas box 220is coupled, and may at least partially extend parallel to the secondsurface 324 of the spacer 222, or the support bracket 305. As shown, aportion of the gas box 220 crosses a plane of the first surface 321 ofthe spacer 222 extending within the processing chamber 205 parallel tothe second surface 324 of the spacer 222. The portion of the gas box 220may be a recessed portion of the gas box 220 within the processingchamber 205, and the recessed portion of the gas box 220 may bepositioned adjacent a portion of the support bracket 305 extending alongthe second surface 324 of the spacer 222. In embodiments the gas box 220may not extend perfectly parallel, and may extend at an angle towards oraway from the second surface 324 of the spacer 222 as well. The supportbracket 305 may be at least partially positioned between the secondsurface 324 of the spacer 222 and a portion of the gas box 220 that isat least partially extending parallel to the second surface 324 of thespacer 222. The support bracket 305 may be spaced between the spacer 222and gas box 220 in embodiments, or may be directly contacting one orboth of the second surface 324 of the spacer 222, or the portion of thegas box 220 that is at least partially extending parallel to the secondsurface 324 of the spacer 222.

Seated on support bracket 305 may be a gas distribution plate 310 thatis configured to provide a uniform flow of precursor or plasma effluentinto the processing region of the processing chamber 205 for interactionwith the substrate. In embodiments, gas distribution plate 310 may beseated on support bracket 305 without additional coupling material, andmay seat directly on support ledge 307. An annular liner 312 may beseated or positioned on gas distribution plate 310 and may extend aboutthe interior of processing chamber 205 to cover an otherwise exposedregion or interior surface of support bracket 305.

A top plate 314 may be positioned or seated on the annular liner 312,and positioned proximate a surface of the gas box facing the interior ofprocessing chamber 205. The top plate 314 may extend about an outletfrom delivery tube 216 and may directly contact the outlet from deliverytube 216 to reduce or prevent precursor or plasma effluent flow fromcontacting the surface of gas box 220 facing the interior of thechamber. Additionally, the top plate 314 may extend past or within anouter diameter of the access defined by the gas box 220, and may or maynot directly contact the delivery tube 216 or an adaptor positioned atan outlet of the delivery tube 216. In embodiments a gap may be presentbetween the top plate 314 and the gas box 220, or the top plate 314 maybe flush and directly contacting the gas box 220. In embodiments the gapmay be less than 5 cm, and may be equal to or less than about 4 cm, 3cm, 2 cm, 1 cm, 0.5 cm, 0.1 cm, or 0 cm in which case the top plate 314is directly contacting the gas box 220. The top plate 314 may be a flatplate defining an aperture at a location at which delivery tube 216contacts or meets the top plate 314. The top plate 314 may otherwise bea solid design to protect gas box 220 from exposure to precursors orplasma effluents.

One or more of gas distribution plate 310, annular liner 312, and topplate 314 may compose the gas distribution assembly 225 of FIG. 2. Eachof these components may be coated or designed to be inert or havereduced impact from plasma effluents and precursors. For example, gasdistribution plate 310, annular liner 312, and top plate 314 may each bemade from or include quartz in embodiments, or may be made or coatedwith material that is unreactive or has reduced reactivity to corrosivematerials including fluorine or chlorine. For example, any of the gasdistribution plate 310, annular liner 312, or top plate 314 may beceramic, or may be coated or anodized aluminum. While gas distributionplate 310 may uniformly disperse precursors or plasma effluents fromdelivery tube 216 into the processing region of processing chamber 205,annular liner 312 and top plate 314 may be used to protect additionalcomponents within the processing chamber. For example, as precursors orplasma effluents are distributed from delivery tube 216, the precursorsmay flow radially outward within gas distribution assembly 225 and atleast partially fill the cavity of gas distribution assembly 225 definedbetween gas distribution plate 310, annular liner 312, and top plate314. Annular liner 312 and top plate 314 may prevent the reactiveprecursors or plasma effluents from contacting gas box 220 and supportbracket 312 before being distributed or flowed through gas distributionplate 310.

Once precursors distribute through the gas distribution plate 310, theflow may at least partially contact support bracket 305 or spacer 222.This contacting may be minimized based on a pressurized or vacuum flowthrough the chamber. Accordingly, a region of the processing chamber 205between the delivery tube 216 and the gas distribution plate 310 may bea location where residence time within the chamber of the precursors islonger than after the precursors have flowed through the gasdistribution plate 310. By covering the otherwise exposed portions ofthe processing chamber 205 including the interior facing surfaces of thesupport bracket 305 and gas box 310 with, respectively, the annularliner 312 and top plate 314. Chamber component lifetime may be improved,which may reduce replacement costs over the lifetime of the processingchamber 205. At least portions of the spacer 222 and support bracket 305may be aluminum and may be contacted by the precursors or plasmaeffluents after distribution or flow through the gas distribution plate310. The spacer 222 and support bracket 305, or at least the exposedsurfaces of these components, thus may be coated or be composed ofmaterials such as hard anodized aluminum to reduce their degradation.Additionally these materials may also be composed of or include quartz,ceramics, or other non or less reactive materials.

FIG. 4 illustrates a schematic cross-sectional view of a delivery system400 for an exemplary processing chamber according to embodiments of thepresent technology. FIG. 4 may include components as previouslyillustrated in FIGS. 2 and 3, and may include RPS unit 210, platform212, delivery tube 216, flange adaptor 218, gas box 220, and top plate314, for example. As illustrated, the delivery tube 216 may couple theprocessing chamber 205 at the access defined by the gas box 220 with RPSunit 210. Because of the exposure to plasma effluents that may becorrosive, delivery tube 216 may be composed of or include a coated orprotected material, such as hard anodized aluminum, or a coatedaluminum. In embodiments, delivery tube 216 may also include a liner,such as a quartz liner, along the interior of the delivery tube 216 thatmay be exposed to plasma effluents.

One or more gaskets or o-rings 405 a-c may be included betweencomponents such as the RPS unit 210 and the platform 212, platform 212and flange adaptor 218, as well as flange adaptor 218 and gas box 220.An adaptor 410 may be included coupling the delivery tube 216 with theRPS unit 210 in embodiments. The adaptor 410 may be at least partiallyquartz, and may include a flange or shim. The flange or shim of adaptor410 may allow an improved seal between the RPS unit 210 and the deliverytube 216 to protect components including o-ring or gasket 405 a frombeing contacted by plasma effluents, which may corrode the o-ring orgasket 405 a, RPS unit 210, or platform 212. The flange or shim may be afoil o-ring in embodiments or another material providing a seal betweenthe components, and that may also be inert to or protected fromcorrosion by precursors or plasma effluents, such as with a coating,protective layer, or material selection. Delivery tube 216 may alsoinclude an adaptor 415 coupled with an outlet of the delivery tube 216.The adaptor 415 may be coupled with the gas box 220 or top plate 314 inembodiments. In embodiments the adaptor 415 may be an adaptation of thetop plate 314 that may be shaped, tapered, flanged, or otherwiseadjusted to reduce or prevent exposure of the gas box 220 to precursorsor plasma effluents being delivered through delivery tube 216.

FIGS. 5A-5B illustrate exemplary structures for the gas distributionplate 310 according to embodiments of the present technology. Asillustrated in FIG. 5A, gas distribution plate 310 a may include one ormore rings of apertures extending radially outward from a central axisof the gas distribution plate 310 a. The rings may include any number ofapertures that may be grouped or spaced to adjust the amount of flowthrough the gas distribution plate 310 a. As illustrated, the gasdistribution plate 310 a includes four rings of apertures with eachradially outward ring including apertures characterized by a largerdiameter than more internal rings. In embodiments adjustments can bemade both to the number of rings as well as the size and shape of theapertures. For example, the gas distribution plate may have 2, 3, 4, 5,6, 7, 8, 9, 10, or more rings extending radially outward from thecentral axis of the gas distribution plate 310 a. Additionally, thenumber of apertures included in each ring as well as the spacing betweeneach aperture within a ring may be adjusted. For example, each ring mayhave less than or about 3, 4, 5, 6, 8, 10, 15, 20, 25, 30, 35, 40, 45,50, 60, 70, 80, 90, or more apertures per ring. Additionally, thespacing between each aperture may be similar or different from oneaperture to the next within a ring, as well as between rings. Suchadjustments can be used to optimize flow through the gas distributionplate 310 a.

FIG. 5B illustrates a gas distribution plate 310 b having a plurality ofrings of equally sized apertures. As illustrated, one or more of therings may be rotated or offset from an adjacent ring. Such a design mayprovide a more uniform flow through the gas distribution plate 310 b.The apertures may have similar or different sizes throughout the gasdistribution plate either within a particular ring or across rings.Additionally, the spacing between apertures may be uniform or differentwithin a ring or between rings. For example, an exemplary gasdistribution plate 310 b may include a plurality of rings having uniformaperture sizes between about 0.1 mm and about 10 mm. The aperture sizesmay be between about 1 mm and about 5 mm, or between about 2 mm andabout 4 mm in embodiments. Additionally, each ring may have betweenabout 3 and about 100 apertures or more. For example, rings toward theinterior of the gas distribution plate 310 b may include fewerapertures, while rings radially outward from the center of the gasdistribution plate 310 b may include more apertures. Accordingly, anysmaller range of apertures within a ring is specifically included by thelarger range. It is to be understood that FIGS. 5A and 5B are merelyexamples of gas distribution plate 210 designs and configurations, andany number of modifications to aperture location, size, and shape areadditionally encompassed by the present technology.

Turning to FIG. 6 is shown a schematic cross-sectional view of a portionof an exemplary processing system 600 according to embodiments of thepresent technology. The processing system 600 may include certainsimilar components as the system illustrated in FIG. 2, for example. Theprocessing system 600 may include a remote plasma source (“RPS”) unit610 positioned on a platform 612 with support members 614. The RPS unit610, platform 612, and support members 614 may be similar to thosepreviously described. The processing system 600 may further include adelivery tube 616 supported by an additional flange adaptor 618, and thedelivery tube 616 may be coupled with the RPS unit 610. Although thedelivery tube 616 and flange adaptor 618 may have similarcharacteristics to those previously described, the dimensions may differfrom those of FIG. 2 based on differences with processing chamber 605.For example, both delivery tube 616 and flange adaptor 618 may havesmaller length dimensions than those of the processing systemillustrated in FIG. 2. These differences, and their advantages, will beexplained in detail below.

As illustrated in FIGS. 2 and 3, processing chamber 205 may include ahinged design having the support bracket 205 lowered within theprocessing chamber 205 and positioned on spacer 222. Gas box 220 maythen be positioned on top of the components and coupled with the spacer222. This design may pose difficulties with removing the support bracket205 for replacement as well as insertion of the support bracket 205during production of the processing chamber 205. Potentially the supportbracket 205, during initial positioning or replacement, may scratch thespacer 222. If the spacer 222 has a coating or an anodized finish,surface defects or scratches may provide locations for corrosion, orearlier corrosion, if contacted by precursors or plasma effluents.Accordingly, processing chamber 605 additionally includes features forease of production and replacement.

Processing chamber 605 includes a gas box 620 defining an access to thesemiconductor processing chamber 605 for delivery tube 616. The gas box620 may be coupled about a distal region of the delivery tube 616, orthe delivery tube 616 may pass through the gas box 620 in embodiments.Gas box 620 may include a planar or substantially planar surface towhich the flange adaptor 618 is coupled. The processing chamber 605 mayalso include a first annular support 622 contacting the gas box 620along a surface opposite the planar or substantially planar surface ofthe gas box 620. The first annular support 622 may contact the gas box620 at a first surface of the annular support. The first annular support622 and the gas box 620 together may define at least a portion of afirst channel 623 about an interior region of the processing chamber.The first channel 623 may be located at the interface of the gas box andthe first annular support. The first annular support 622 may define arecessed ledge at an inner diameter of the first annular support. Thegas box 620 may define a recessed ledge within the surface opposite theplanar or substantially planar surface of the gas box 620. The recessedledge defined by the gas box 620 may be defined to coincide with thelocation of the recessed ledge of the first annular support 622 todefine the first channel 623. A gas distribution assembly 625 may bepositioned or seated within the first channel.

Gas distribution assembly 625 may include a gas distribution plate,annular liner, and top plate as previously described, or may includefewer of the components. For example, gas distribution assembly 625 maybe a gas distribution plate seated within the first channel 623. Inembodiments, an annular liner may be seated on the gas distributionplate, and a top plate may be seated on the annular liner, and both theannular liner and top plate may be at least partially seated within thefirst channel 623. The components of the gas distribution assembly 625may be positioned to protect surfaces of the first channel 623, gas box620, and first annular support 622 from exposure to precursors or plasmaeffluents delivered via delivery tube 616. The first channel 623 mayhave dimensions equivalent to the gas distribution assembly 625 so thegas distribution assembly is flush within the first channel 623. Inother embodiments the first channel may have one or more gaps along anexterior diameter of the gas distribution assembly, as well as betweenthe top plate and the gas box 620 as previously described.

In some embodiments a second annular support 624 may be included and maycontact the first annular support 622 at a second surface of the firstannular support 622 opposite the first surface of the first annularsupport 622. The second annular support 624 may have a similar shape asthe first annular support 622. In embodiments, the second annularsupport 624 may have a thickness greater than or less than the firstannular support 622. The second annular support 624 may also define arecessed ledge at an inner diameter of the second annular support,similar to the first annular support 622. The recessed ledge of thesecond annular support 624 along with the second surface of the firstannular support 622 may each at least partially define a second channel626 about an interior region of the semiconductor processing chamber.Although not illustrated, the first annular support 622 may also definea recessed ledge within the second surface of the first annular supportsimilar to the gas box 620. This recessed ledge may increase the heightof the second channel 626 to accommodate additional components similarto those of gas distribution assembly 625.

The processing chamber 605 may also include a second gas distributionplate 627 seated within the second channel 626. Second gas distributionplate 627 and the gas distribution plate of gas distribution assembly625 may be similar or different designs, and may both be made of orinclude quartz or materials as previously described. The gasdistribution plates may have similar aperture configurations to oneanother, or different configurations from one another, and either orboth gas distribution plates may include a configuration similar tothose discussed with respect to FIGS. 5A-5B. For example, the first gasdistribution plate of gas distribution assembly 625 and the second gasdistribution plate 627 may be characterized by a similar shape, and mayeach define a plurality of apertures located in rings about theindividual gas distribution plate. In embodiments the plates may havethe apertures be aligned or may have the apertures offset from oneanother to improve uniformity of flow through the plates. Although notillustrated, it is to be understood that the processing chamber 605 mayalso include a pedestal, heater, and other components as described withrelation to FIG. 2.

The gas box 620, the first annular support 622, and the second annularsupport 624 may have similar external diameters and be stacked to atleast partially define the outer dimensions of the processing chamber605, as well as at least partially define the dimensions of the interioror processing region of the processing chamber 605. The components maybe stacked as illustrated to define the first channel 623 and secondchannel 626. This stacked design as well as the planar surface of gasbox 620 may allow for shorter support members 614, adaptor flange 618,and delivery tube 616. The height of these components may be reducedbecause the different gas box 620 design may not include the recessedportion extending into the processing chamber 605. As such, the deliverytube 616 may be of a reduced length to access the interior of theprocessing chamber 605. By reducing the delivery tube length, precursorsor plasma effluents delivered to the processing chamber 605 may have ashorter flow path to the substrate. By reducing the length of the flowpath, dissociation of plasma precursors may be maintained, and anetching process may be more efficient than when performed in a chamberwith a longer flow path from plasma effluent generation to contact witha substrate or material to be etched.

FIG. 7 illustrates a cross-sectional plan view of an exemplary gasdistribution plate 725 according to embodiments of the presenttechnology. The figure shows the coupling of the gas distribution plate725 to the first annular support 622 as discussed above, along with aperspective from the delivery tube 616. As illustrated, pins 631 areincluded to support and locate the gas distribution plate 725 to preventor reduce movement of the plate within the first channel 623. Unlikebeing seated on a support bracket such as in FIG. 2, by utilizing thefirst annular support member 622, a direct connection can be made toensure proper position or orientation of the gas distribution plate 725.The processing chamber 605 may include at least one pin 631, and mayinclude any number of pins such as pins 631 a, 631 b, and 631 c, forexample that may removably couple the gas distribution plate 725 withthe first annular support 622.

The pins may extend through the first annular support 622 in embodimentsto additionally pin the second gas distribution plate 627 to the secondannular support 624, or may be stopped within the first annular support622 in embodiments. The pins may merely hold the plates in relativeposition, or may specifically fix the plates in position such as with acoupling member, such as, e.g. a bolt, screw, etc., that may preventwithdrawal of the component without removal of the coupling member.During production, the gas distribution plate 725 may be slid onto thepins before the gas box 620 is coupled with the first annular support622. The gas distribution plate 725 may then be prevented orsubstantially prevented from moving during processing, which mayotherwise allow one or more components to become scratched or have acoating or protective layer removed or damaged.

Turning to FIG. 8 is shown a schematic cross-sectional view of a portionof an exemplary processing chamber 800 according to embodiments of thepresent technology. Processing chamber 800 may be similar to processingchamber 605 of FIG. 6 with adjustments to the delivery tube 816, adaptorflange 818, and gas box 820. Although several components of theprocessing system are not shown, other components may be as previouslydescribed. As shown, the adaptor flange 818 may define a port 825 and atleast a portion of a channel 827 for providing access for a precursorconfigured to bypass an RPS unit and enter the delivery tube 816 and theprocessing chamber 805. The delivery tube 816 may also define at least aportion of the channel 827 between the RPS unit and the gas box 820 toallow precursor delivery into the semiconductor processing chamber 820.The delivery tube 816 may also define one or more apertures 828providing access for precursors or plasma effluents from the RPS unit.In embodiments, the apertures 828 may be spaced about the delivery tubeto provide access around the channel 827.

An insert 829 may be positioned within the delivery tube 816 asillustrated in the figure. The insert 829 may provide access to a mixingregion 830 of the insert 829 from the RPS unit and the at least aportion of the channel 827 of the delivery tube 816. The mixing region830 of the insert 829 may be characterized by multiple mixing sections.A first mixing section 831 may be characterized by a tapered shape fromthe access to the mixing region 830 of the insert 829. The access to themixing region may have a diameter up to the inner diameter of thedelivery tube 816 in embodiments. The mixing region 830 of insert 829may also include a second mixing section 833 characterized by anexpanding internal diameter from a position proximate the first mixingsection 831 to an outlet of the delivery tube 816.

The mixing region 830 may further include a third mixing section 835characterized by a cylindrical shape having an internal diameter that issmaller than the internal diameter of the delivery tube 816. Forexample, the third mixing section 835 may have an internal diameter thatis less than or about 90% of the internal diameter of the delivery tube816. The internal diameter of the third mixing section 835 may also beless than or about 85%, 80%, 75%, 65%, 60%, 55%, 50%, 45%, 40%, 35%,30%, 25%, 20%, 15%, 10%, or 5% of the internal diameter of the deliverytube 816 in embodiments. The internal diameter of the third mixingsection may also be greater than or about 5%, 10%, 15%, 20%, 25%, 30%,35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, or 95% ofthe internal diameter of the delivery tube 816 in embodiments. Byincluding the mixing sections and the insert, precursors introducedthrough the channel 827 may be mixed more uniformly with precursors orplasma effluents introduced through the RPS unit before entering theprocessing chamber 805.

As illustrated in FIG. 8, gas box 820 may be made of multiple plates toallow further access for bypass precursors that may be maintainedseparate from any precursors or plasma effluents introduced from the RPSunit until they enter the processing chamber 805. The gas box 820 mayinclude a first gas box plate 840 and a second gas box plate 842 thatare coupled with one another in embodiments. The second gas box plate842 may at least partially contact a first annular support 622 along asecond surface of the second gas box plate 842. The second surface ofthe gas box plate 842 may be opposite a first surface of the second gasbox plate 842 that is in contact with the first gas box plate 840. Thesecond gas box plate 842 may define a compound channel or a plurality ofchannels 845 in embodiments. When the first gas box plate 840 is coupledwith the second gas box plate, a flow path may be defined through thecompound channel or plurality of channels 845. The first gas box plate840 may additionally define a port 847 providing access to at least onechannel of the plurality of channels 845. A bypass precursor may beintroduced through the port 847 and be flowed into the processingchamber separately from plasma effluents.

FIG. 9 shows a cross-sectional plan view of an exemplary gas box 820arrangement according to embodiments of the present technology. Asdescribed above, the gas box 820 may include a first gas box plate 840and a second gas box plate 842 coupled together. The two plates of thegas box 820 define an access for delivery tube 816. A plurality ofchannels 845, which may be considered a compound channel, are definedwithin the second gas box plate 842. A port 847 in first gas box plate840 may provide access to the plurality of channels 845 and a flow pathfrom the port 847 for a precursor that may bypass the RPS unit. Theplurality of channels 845 may provide a flow pattern for more uniformlydispersing the precursor introduced through port 847 into processingchamber 805. The plurality of channels 845 may be defined to produce arecursive flow of an introduced bypass precursor from the port 847throughout the plurality of channels 845.

The second gas box plate 842 may additionally define at least onechannel 949, such as an entry channel, providing access from theplurality of channels 845 to an interior region of the semiconductorprocessing chamber 805. The second gas box plate 842 may also define aplurality of channels 949 to provide more uniform flow of a precursorinto the processing region. Channels 949 defined by the second gas boxplate 842 may be positioned or located radially outward from the port847 defined by the first gas box plate 840 in embodiments. Such aconfiguration may provide more uniform distribution of the precursorthrough the channels 845 before entering the processing chamber 805through the channels 949 in second gas box plate 842.

FIG. 10 illustrates a cross-sectional view of a portion of an exemplarygas box 820 arrangement according to embodiments of the presenttechnology. Gas box 820 may include a first gas box plate 840 and asecond gas box plate 842 as previously described. Second gas box plate842 may define a plurality of channels 845, as well as one or more entrychannels 949 providing access to the processing chamber 805 previouslydiscussed. A precursor may bypass the RPS unit and enter the processingchamber through entry channels 949 and contact a gas distributionassembly, such as gas distribution assembly 625 previously discussed.Gas distribution assembly 625 may include a top plate 1020, which mayinclude one or more apertures 1025 allowing the bypass precursor toenter the gas distribution assembly 625 and be distributed to asubstrate for processing. Additionally, or alternatively, top plate 1020may not include apertures 1025 in which case the bypass precursorentering the processing chamber 949 may pass around gas distributionassembly 625 to enter a processing region of the processing chamber. Afirst annular support on which the gas distribution assembly 625 may beseated may define notches by which the bypass precursor may pass the gasdistribution assembly 625. The bypass precursor may then be maintainedfluidly separate from any precursors or plasma effluents distributedfrom the RPS unit until after the precursors have passed through the gasdistribution assembly 625. The gas distribution assembly 625 may also bepositioned flush with a sidewall of the gas box 820 to ensure the bypassprecursor enters the gas distribution assembly 625 through apertures1025 in top plate 1020 in embodiments.

FIG. 11 illustrates a method 1100 of etching a substrate according toembodiments of the present technology. Method 1100 may includedelivering a chlorine-containing precursor to an RPS unit whilegenerating a plasma to produce plasma effluents at operation 1110. Atoperation 1120, the plasma effluents may be flowed into a processingchamber and through a quartz gas distribution plate. The plasmaeffluents may etch a substrate housed within the processing chamber atoperation 1030. The processing chamber may be any of the chambersdiscussed in the preceding sections. The etching operation may beconducted at a temperature between about 300° C. and about 500° C. inembodiments and may be below about 300° C. in embodiments.

The etching process may additionally include introducing one or moreprecursors that bypass the RPS unit through any of the previouslydescribed ports. The chamber may be maintained under vacuum inembodiments, and may also be pressurized to about 1 Torr or greater,such as up to about 3 Torr, up to about 5 Torr, up to about 10 Torr, upto about 20 Torr, or higher. When performing method 1100 in one of thechambers described with relation to the previous figures, the chambercomponents may be protected from the plasma effluents. Consequently thechamber components may not degrade as quickly as unprotected components,and may require less maintenance, less cleaning, and less frequentreplacement than some conventional chamber components. Additionally, thechambers described may allow a shorter flow path from the remote plasmaunit to the substrate, which may increase the efficiency of etchingoperations due to less recombination of dissociated chlorine.

In the preceding description, for the purposes of explanation, numerousdetails have been set forth in order to provide an understanding ofvarious embodiments of the present technology. It will be apparent toone skilled in the art, however, that certain embodiments may bepracticed without some of these details, or with additional details.

Having disclosed several embodiments, it will be recognized by those ofskill in the art that various modifications, alternative constructions,and equivalents may be used without departing from the spirit of theembodiments. Additionally, a number of well-known processes and elementshave not been described in order to avoid unnecessarily obscuring thepresent technology. Accordingly, the above description should not betaken as limiting the scope of the technology.

Where a range of values is provided, it is understood that eachintervening value, to the smallest fraction of the unit of the lowerlimit, unless the context clearly dictates otherwise, between the upperand lower limits of that range is also specifically disclosed. Anynarrower range between any stated values or unstated intervening valuesin a stated range and any other stated or intervening value in thatstated range is encompassed. The upper and lower limits of those smallerranges may independently be included or excluded in the range, and eachrange where either, neither, or both limits are included in the smallerranges is also encompassed within the technology, subject to anyspecifically excluded limit in the stated range. Where the stated rangeincludes one or both of the limits, ranges excluding either or both ofthose included limits are also included.

As used herein and in the appended claims, the singular forms “a”, “an”,and “the” include plural references unless the context clearly dictatesotherwise. Thus, for example, reference to “an aperture” includes aplurality of such apertures, and reference to “the plate” includesreference to one or more plates and equivalents thereof known to thoseskilled in the art, and so forth.

Also, the words “comprise(s)”, “comprising”, “contain(s)”, “containing”,“include(s)”, and “including”, when used in this specification and inthe following claims, are intended to specify the presence of statedfeatures, integers, components, or operations, but they do not precludethe presence or addition of one or more other features, integers,components, operations, acts, or groups.

What is claimed is:
 1. A semiconductor processing system comprising: aremote plasma source; a delivery tube coupled with the remote plasmasource; and a semiconductor processing chamber, wherein thesemiconductor processing chamber comprises: a gas box coupled about adistal region of the delivery tube, wherein the gas box comprises afirst gas box plate and a second gas box plate coupled with one another,wherein the second gas box plate defines a plurality of channels withina first upper surface of the second gas box plate, and wherein a lowersurface of the coupled first gas box plate and the first upper surfaceof the second gas box plate define a flow path through the plurality ofchannels; a first annular support contacting the gas box at a firstsurface of the first annular support, wherein the first annular supportand the gas box together define a first channel about an interior regionof the semiconductor processing chamber, and wherein the second gas boxplate at least partially contacts the first annular support along asecond surface of the second gas box plate opposite the first surface ofthe second gas box plate contacting the first gas box plate and a gasdistribution plate seated within the first channel.
 2. The semiconductorprocessing system of claim 1, further comprising: an annular linerseated on the gas distribution plate; and a top plate seated on theannular liner, wherein the annular liner and the top plate are both atleast partially seated within the first channel.
 3. The semiconductorprocessing system of claim 1, further comprising a second annularsupport contacting the first annular support at a second surface of thefirst annular support opposite the first surface of the first annularsupport, wherein the second annular support and the first annularsupport together define a second channel about an interior region of thesemiconductor processing chamber.
 4. The semiconductor processing systemof claim 3, wherein the gas distribution plate comprises a first gasdistribution plate, the semiconductor processing system furthercomprising a second gas distribution plate seated within the secondchannel.
 5. The semiconductor processing system of claim 4, wherein thefirst gas distribution plate and the second gas distribution platecomprise quartz, a ceramic, or coated aluminum.
 6. The semiconductorprocessing system of claim 1, further comprising at least one pinremovably coupling the gas distribution plate with the first annularsupport.
 7. The semiconductor processing system of claim 1, wherein thedelivery tube defines at least a portion of a channel between the remoteplasma source and the gas box configured to allow precursor deliverythrough the delivery tube into the semiconductor processing chamber thatbypasses the remote plasma source.
 8. The semiconductor processingsystem of claim 7, further comprising an insert positioned within thedelivery tube, wherein the insert provides access to a mixing region ofthe insert from the remote plasma source and the at least a portion of achannel of the delivery tube.
 9. The semiconductor processing system ofclaim 8, wherein the mixing region of the insert comprises a firstmixing section characterized by a tapered shape from the access to themixing region of the insert, and wherein the mixing region of the insertcomprises a second mixing section characterized by an expanding internaldiameter from a position proximate the first mixing section to an outletof the delivery tube.
 10. The semiconductor processing system of claim9, wherein the mixing region of the insert further comprises a thirdmixing section characterized by a cylindrical shape having an internaldiameter that is less than half the internal diameter of the deliverytube.
 11. The semiconductor processing system of claim 1, wherein thefirst gas box plate defines a port providing access to a channel of theplurality of channels defined in the second gas box plate.
 12. Thesemiconductor processing system of claim 11, wherein the plurality ofchannels desfined in the second gas box plate are configured todistribute a precursor received in the port radially outward through theplurality of channels defined in the second gas box plate.
 13. Thesemiconductor processing system of claim 12, wherein the second gas boxplate defines at least one entry channel providing access from theplurality of channels to an interior region of the semiconductorprocessing chamber.
 14. A semiconductor processing system comprising: aremote plasma source; a delivery tube coupled with the remote plasmasource; and a semiconductor processing chamber, wherein thesemiconductor processing chamber comprises: a gas box providing accessto the semiconductor processing chamber, wherein the gas box comprises afirst gas box plate coupled with a second gas box plate along a firstsurface of the second gas box plate, wherein the second gas box platedefines a plurality of channels within the first upper surface of thesecond gas box plate, and wherein the coupled first gas box plate andsecond gas box plate define a flow path between a lower surface of thefirst gas box plate and the first upper surface of the second gas boxplate through the plurality of channels; a first annular supportcontacting the gas box at a first surface of the first annular support,wherein the first annular support and the gas box each define a portionof a first channel located at an interface of the gas box and the firstannular support; a first gas distribution plate seated within the firstchannel; a second annular support contacting the first annular supportat a second surface of the first annular support opposite the firstsurface of the first annular support, wherein the second annular supportat least partially defines a second channel located about an interiorregion of the semiconductor processing chamber; and a second gasdistribution plate seated within the second channel, wherein the firstgas distribution plate and the second gas distribution plate comprisequartz.
 15. The semiconductor processing chamber of claim 14, furthercomprising: an annular liner seated on the first gas distribution plate;and a top plate seated on the annular liner, wherein the annular linerand the top plate are both at least partially seated within the firstchannel.
 16. The semiconductor processing chamber of claim 14, whereinthe first gas distribution plate and the second gas distribution plateare characterized by a similar shape and each define a plurality ofapertures located in rings about the gas distribution plate.
 17. Thesemiconductor processing chamber of claim 14, wherein the first gas boxplate defines a port providing access to a channel of the plurality ofchannels defined in the second gas box plate.
 18. The semiconductorprocessing chamber of claim 17, wherein the plurality of channelsdesfined in the second gas box plate are configured to distribute aprecursor received in the port radially outward through the plurality ofchannels defined in the second gas box plate.
 19. The semiconductorprocessing chamber of claim 18, wherein the second gas box plate definesat least one entry channel providing access from the plurality ofchannels to an interior region of the semiconductor processing chamber.